A new interconnection/transition method using bumping-bridge structure for 1-level package of RF MEMS devices

Author

Lei Chen ; Wei Xu ; Deyang Yan ; Cheng Zhao ; Yi Wang ; Yue Sun

Author_Institution

Sch. of Phys. Sci. & Technol., Yangzhou Univ., Yangzhou, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

599

Lastpage

601

Abstract

A novel 1-level interconnection/transition method for radio frequency micro-electronic-mechanic system (RF MEMS) devices is proposed in this paper. Using bumping-bridge structure which is composed of a chip substrate, a coplanar waveguide (CPW) transmission line fabricated on the substrate and a group of metal bumps set on the ends of the CPW line, this method combines the advantages of both flip-chip and through-silicon via (TSV) techniques. The results of the finite element method (FEM) analysis show that this interconnection/ transition structure has good characteristics of return loss and insertion loss over a broad frequency range compared with both TSV and wire-bonding structures.

Keywords

coplanar waveguides; finite element analysis; flip-chip devices; lead bonding; micromechanical devices; radiofrequency interconnections; three-dimensional integrated circuits; 1-level interconnection-transition method; 1-level package; CPW transmission line; FEM analysis; RF MEMS devices; TSV technique; bumping-bridge structure; chip substrate; coplanar waveguide transmission line; finite element method; flip-chip technique; insertion loss; interconnection-transition method; metal bumps; radiofrequency microelectronic-mechanic system devices; return loss; through-silicon via technique; wire-bonding structures; Coplanar waveguides; Flip-chip devices; Insertion loss; Micromechanical devices; Radio frequency; Substrates; Through-silicon vias; FEM; RF MEMS; TSV; bumping-bridge; interconnection; transition;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922727

Filename

6922727