• DocumentCode
    1185489
  • Title

    Polymer-based wide-bandwidth and high-sensitivity micromachined electron tunneling accelerometers using hot embossing

  • Author

    Cui, Tianhong ; Wang, Jing

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Minnesota, Minneapolis, MN, USA
  • Volume
    14
  • Issue
    5
  • fYear
    2005
  • Firstpage
    895
  • Lastpage
    902
  • Abstract
    The first PMMA-based membrane tunneling accelerometers were fabricated by hot embossing replication with silicon molds. The silicon molds were prepared by a combinative etching technique involving anisotropic bulk etching and modified plasma dry etching. The constructed molds hold both pyramid pits and positive profile sidewalls with smooth surfaces and steep angles, which were necessary for the hot embossing demolding. After electrodes patterned on embossed PMMA structures, the accelerometers, 8 mm ×8 mm ×1 mm, were packaged and assembled on a measurement circuit board. The exponential relationship between tip currents and applied deflection voltages presented a tunneling barrier height of 0.17 eV. The natural frequency of sensors was about 128 Hz. The bandwidth of the feedback system was 6.3 kHz. The sensitivity of voltage over acceleration was 20.6 V/g, and the resolution was 0.2485 μg/√Hz (g=9.8 m/s2).
  • Keywords
    accelerometers; embossing; micromachining; microsensors; moulding; polymers; replica techniques; sputter etching; tunnelling; 0.17 eV; 1 mm; 6.3 kHz; 8 mm; PMMA-based membrane tunneling accelerometers; anisotropic bulk etching; applied deflection voltages; embossed PMMA structures; high-sensitivity micromachined electron tunneling accelerometers; hot embossing demolding; hot embossing replication; modified plasma dry etching; polymer-based wide-bandwidth accelerometers; positive profile sidewalls; pyramid pits; silicon molds; tip currents; Accelerometers; Biomembranes; Dry etching; Electrons; Embossing; Plasma measurements; Polymers; Silicon; Tunneling; Voltage; Accelerometer; MEMS; PMMA; electron tunneling; hot embossing;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2005.851865
  • Filename
    1516171