DocumentCode
118561
Title
A new fast moisture sensitivity analysis method using equal moisture distribution simulation
Author
Xiaosong Ma
Author_Institution
Dept. of Mech. Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
676
Lastpage
679
Abstract
MSLA, the abbreviation of Moisture Sensitivity Level Analysis, is the meaning of moisture sensitivity level analysis. MSLA is to give the proposed package moisture sensitivity of surface mount components provide a standard of classification, so that different types of components to get the correct packaging, storage and handling to avoid moisture resulted failures in the assembly or repair process. But traditional moisture sensitivity level characterizations take long time even the fast level 1, 85°C/85%RH conditioning needs 168 hours. The purpose of the paper is introducing a fast moisture diffusion method using high temperature and high relative humidity to increase moisture diffusion speed by numerical simulation, which will assist the moisture diffusion time.
Keywords
assembling; diffusion; maintenance engineering; moisture; numerical analysis; sensitivity analysis; surface mount technology; MSLA; assembly process; classification standard; component handling; component storage; equal moisture distribution simulation; fast moisture diffusion method; fast moisture sensitivity analysis method; moisture sensitivity level analysis; numerical simulation; packaging; repair process; surface mount components; Acceleration; Materials; Moisture; Packaging; Qualifications; Sensitivity; Standards; equal moisture distribution; fast moisture diffusion; moisture diffusion model; moisture sensitivity level analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922744
Filename
6922744
Link To Document