Title :
Signal integrity analysis of a high-performance processor package with silicon interposer
Author :
Xiaoli Ren ; Cheng Pang ; Feng Jiang ; Zheng Qin ; Kai Xue ; Haiyan Liu ; Daquan Yu
Author_Institution :
Nat. Center for Adv. Packaging, Wuxi, China
Abstract :
This paper presents signal integrity analysis of a high-performance processor package with silicon interposer. Thediewas attached on the top side of the siliconinterposer with through silicon vias (TSVs), and theinterposer was connected to the organic substrate. The signal transmission path of this package consists of two redistribution layers (RDLs), TSVson interposer, and wirings on the substrate. The detailed signal integrity analysis with 3D full-wave electromagnetic method and equivalent circuit method are presented to verify the signaltransmission characteristics of the system. The co-simulation of this 2.5D package including silicon interposer and organic substrate is also presented in this paper.
Keywords :
elemental semiconductors; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; silicon; three-dimensional integrated circuits; 2.5D package; 3D full-wave electromagnetic method; TSV; equivalent circuit; organic substrate; processor package; redistribution layers; signal integrity analysis; signal transmission path; silicon interposer; through silicon via; Conferences; Fabrication; Insertion loss; Propagation losses; Silicon; Substrates; Through-silicon vias; electrical simulation; signal integrityanalysis; silicon interposer; through silicon vias; transmissioncharacteristics;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922777