DocumentCode
1186809
Title
CMOS chip for invasive ultrasound imaging
Author
Black, William C., Jr. ; Stephens, Douglas N.
Author_Institution
Northern Microdesign Inc., Golden Valley, MN, USA
Volume
29
Issue
11
fYear
1994
fDate
11/1/1994 12:00:00 AM
Firstpage
1381
Lastpage
1387
Abstract
A very small transmit/receiver chip has been developed for use in an arterial ultrasonic imaging system. In this technique, a solid-state ultrasonic imaging head placed within a small medical catheter is used to provide high quality 360° images of arteries as small as 2 mm in diameter. Novel design and packaging techniques have been used to allow four easily testable 0.86 mm×1.65 mm mixed-signal CMOS die to be placed on a multichip carrier within this 1.83 mm diameter imaging probe. Each chip contains interface circuitry for sixteen transducers including 20 MHz transmit pulsers and receive current amplifiers with approximately 1.3 pA/rt-Hz equivalent input noise performance. The techniques described here are generally applicable to any probe or device with extreme size and performance requirements
Keywords
CMOS integrated circuits; acoustic imaging; biomedical electronics; biomedical ultrasonics; cardiology; mixed analogue-digital integrated circuits; packaging; patient diagnosis; probes; 1.83 mm; 20 MHz; CMOS chip; US imaging probe; arterial ultrasonic imaging system; interface circuitry; invasive ultrasound imaging; medical catheter; mixed-signal CMOS die; multichip carrier; packaging techniques; receive current amplifiers; solid-state US imaging head; transducers; transmit pulsers; transmit/receiver chip; Arteries; Biomedical imaging; Catheters; Circuit testing; Head; Packaging; Probes; Pulse amplifiers; Solid state circuits; Ultrasonic imaging;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/4.328640
Filename
328640
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