Effect of temperature cycling on reliability of flip chip solder joint

Author

Xueming Jiang ; Pengrong Lin ; Yuezhong Song ; Yingzhuo Huang ; Binhao Lian ; Quanbin Yao

Author_Institution

Beijing Microelectron. Technol. Inst., Beijing Aerosp. Syst. Eng. Res. Inst., Beijing, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

989

Lastpage

991

Abstract

This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can effectively improve the thermal fatigue life of solder joints. The content of PbSn bumps in Sn has significant influence on the solder joint reliability.

Keywords

failure analysis; flip-chip devices; reliability; thermal stress cracking; tin compounds; UBM structure; alumina ceramic substrate; chrysanthemum link design; electrically-connected test; failure analysis; flip chip bonding specimen failure; flip chip device; flip chip sample; flip chip solder joint reliability; lead tin bump; solder joint fatigue life; temperature cycling effect; thermal fatigue life; tin lead solder joint reliability; Fatigue; Flip-chip devices; Reliability; Soldering; Stress; Substrates; Tin; Flip chip; High temperature cycle; Reliability; Underfill;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922813

Filename

6922813