Title :
Finite-element analysis of microstrip systems in the vicinity of a substrate edge and approximate formulas for capacitance
Author :
Baginski, Michael E. ; Riggs, Lloyd S. ; German, Fred J. ; Jarriel, George W., Jr.
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
fDate :
11/1/1994 12:00:00 AM
Abstract :
The TEM electrical characteristics of a microstrip system in the vicinity of a dielectric edge are investigated via a series of numerical simulations and empirical formulas based on the simulations derived. A finite-element routine is used as the basis for the simulations that solve the Maxwell equations (∇·D=ρf) subject to the appropriate electromagnetic boundary conditions. The geometric and electrical parameters used in the simulation are selected to be representative of those found typically in printed circuit board fabrications (microstrip features ~10-30 mils). An empirical formulation for the capacitance of the microstrip is developed and shown to be in good agreement with the simulations (maximum difference of 1070). The formulation is also compared to measurements. Several plots of the vector electric-field intensity are presented. These plots identify the general structure of the electric-field intensity near the edge of the dielectric; thereby providing the design engineer with insight into the typical field fringing expected
Keywords :
Maxwell equations; approximation theory; boundary-value problems; capacitance; finite element analysis; microstrip circuits; printed circuits; Maxwell equations; approximate formulas; capacitance; dielectric edge; electrical parameters; electromagnetic boundary conditions; empirical formulas; field fringing; finite-element analysis; finite-element routine; geometric parameters; microstrip systems; numerical simulations; printed circuit board; substrate edge; vector electric-field intensity; Boundary conditions; Circuit simulation; Dielectrics; Electric variables; Finite element methods; Maxwell equations; Microstrip; Numerical simulation; Printed circuits; Solid modeling;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on