DocumentCode :
118803
Title :
Is thermal management outside the package enough for higher LED reliability?
Author :
Qi Chen ; Quan Chen ; Run Hu ; Xiaobing Luo
Author_Institution :
Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
1068
Lastpage :
1070
Abstract :
Thermal management has always been crucial for the improving of LED reliability. Most researches focus on the thermal management outside the package like fin optimization, microchannel, microjet cooling, but few refer to the thermal management inside the package. In this paper, a contrast experiment was carried out by an online testing method to explore the LED´s optical degradation under conditions with/without thermal management inside the LED package. Results show that different LED degradation characteristics appear in the experiment and the sample without package-inside thermal management exhibits carbonization phenomenon. Thermal management inside the package should be further reinforced to enhance the reliability of LED package.
Keywords :
LED displays; circuit reliability; thermal management (packaging); LED package; carbonization phenomenon; fin optimization; light-emitting diode; microchannel; microjet cooling; online testing method; optical degradation; reliability enhancement; thermal management; Degradation; Electronic packaging thermal management; Light emitting diodes; Phosphors; Reliability; Testing; Thermal management; light-emitting diode; online testing method; reliability; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922830
Filename :
6922830
Link To Document :
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