DocumentCode :
118871
Title :
Abnormal grain growth in Cu6Sn5 Grains formed at SN-based solder/Cu interfaces
Author :
Ming Yang ; Mingyu Li ; Jianxin Wu ; Jinhua Xu
Author_Institution :
Shenzhen Grad. Sch., Harbin Inst. of Technol., Shenzhen, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
1181
Lastpage :
1185
Abstract :
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential growth of the Cu6Sn5 at the grain boundary in solder matrix. Additionally, the effects of solder composition on the interfacial IMC growth are evaluated. The results indicate that the Ag addition retards IMC growth upon aging by inhibiting the diffusion of Cu.
Keywords :
copper alloys; matrix algebra; solders; Cu6Sn5; Sn3.5Ag-Cu; abnormal grain growth; eutectic interfaces; grain boundary; interfacial IMC growth; interfacial grains; intermetallic compounds; layer-type morphology; preferential growth; pure interfaces; solder interfaces; solder matrix; solid-state aging; Aging; Grain boundaries; Joints; Morphology; Scanning electron microscopy; Soldering; Tin; IMC; abnormal growth; diffusion; lead-free solders;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922854
Filename :
6922854
Link To Document :
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