• DocumentCode
    118993
  • Title

    A Q-Band very broad band on-chip antenna for Q-LINKPAN applications

  • Author

    Peng Gao ; Ning Wang ; Zhi Ning Chen

  • Author_Institution
    Res. Inst. of Electron. Sci. & Technol., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1344
  • Lastpage
    1346
  • Abstract
    This paper presents a 45GHz on-chip antenna for Q-LINKPAN applications. The antenna has a simple triangle radiating patch that is fed by a 50-Ω modified coplanar waveguide (CPW) structure. Implemented results denote this antenna has a favorable impedance bandwidth from 40-50 GHz, where nearly omni-directional radiation patterns and stable gain are also obtained and shown. Besides, it has a very compact size of 2.5mm ×2.5mm × 0.26mm, which is fabricated by using a standard 0.18-μm CMOS process. Measured results validate the wide frequency response meets the Q-LINKPAN standard requirement, which is a good candidate for mobile high data rate communication systems.
  • Keywords
    CMOS integrated circuits; antenna feeds; antenna radiation patterns; coplanar waveguides; frequency response; millimetre wave antennas; omnidirectional antennas; personal area networks; waveguide antennas; CMOS process; CPW structure; Q-LINKPAN standard application; Q-band very broad band on-chip antenna; antenna feed; bandwidth 40 GHz to 50 GHz; frequency 45 GHz; frequency response; impedance bandwidth; mobile high data rate communication system; modified coplanar waveguide structure; omnidirectional radiation pattern; resistance 50 ohm; simple triangle radiating patch; size 0.18 mum; Antenna measurements; Antenna radiation patterns; CMOS integrated circuits; Millimeter wave communication; Standards; System-on-chip; 45GHz; Q-LINKPAN; on-chip antenna; triangle shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922897
  • Filename
    6922897