• DocumentCode
    119057
  • Title

    Investigation of microstructure and optical property of high power LED based on rapid thermal cycling

  • Author

    Jibing Chen ; Yanfang Yin ; Jianping Ye ; Bing An ; Yiping Wu

  • Author_Institution
    Sch. of Mech. Eng., Wuhan Polytech. Univ., Wuhan, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1464
  • Lastpage
    1467
  • Abstract
    The objective of this paper is to investigate the effect of rapid thermal cycling on microstructure and optical property (luminous flux and luminous efficiency) of high power light emitting diode (LED) by induction heating. Under an application of induction heating as rapid heating source, the specimens that were being non-operating and operating life tests in the experiment were rapidly heated and cooled based on a control system that employs a fuzzy logic algorithm, respectively. The optical performances, including luminous flux, luminous efficiency and radiant power of two kinds of LED specimens were compared and analyzed. It was found that the rapid thermal cycling have similar evident influence on them. The results showed that the color purity of LED was also descended, the correlated color temperature (CCT) was also risen, but their changing rate and extents are different. The high and low temperature distribution in LED chip was simulated by finite element modeling (FEM) which is helpful for the failure analysis and design of the reliability of the LED packaging. The microstucrue of LED chips are analyzed after different rapid thermal cycling time. The results are showed that rapid thermal cycling can affect greatly the LED properties and interface microstructures. All the results indicate that this approach to rapid thermal cycling by using rapid heating source is feasible to investigate the optical performance of high power LED, so it can also effectively verify the reliability of LED devices.
  • Keywords
    electronics packaging; failure analysis; finite element analysis; induction heating; life testing; light emitting diodes; optical properties; reliability; CCT; FEM; LED chip microstucture; LED devices; LED packaging reliability design; color purity; control system; correlated color temperature; failure analysis; finite element modeling; fuzzy logic algorithm; high power LED; high power light emitting diode; induction heating; interface microstructures; low temperature distribution; luminous efficiency; luminous flux; nonoperating life tests; operating life tests; optical property; radiant power; rapid heating source; rapid thermal cycling effect; Electromagnetic heating; Light emitting diodes; Metals; Microstructure; Packaging; Soldering; high-power LED; induction heating; microstucture; optical property; rapid thermal cycling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922930
  • Filename
    6922930