DocumentCode
119063
Title
Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests
Author
Zhang, Grace G. ; Lu, Sophie L. Y. ; Yang, Nick G. M. ; Zou, Sam H. Y. ; Zhong, Steven D. L. ; Lo, Jeffery C. C. ; Lee, S. W. Ricky
Author_Institution
HKUST LED-FPD Technol. R&D Center at Foshan, Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1477
Lastpage
1481
Abstract
In this paper, a fully automated, low-cost, real-time illuminance measurement system for LED long term reliability tests is proposed. The system has only one photodetector to measure the illuminance of all samples inside the test chamber during the reliability test. With a proprietary algorithm, a single photodetector can measure the illuminance of all samples in the chamber by sequential scanning. This system monitors and records the illuminance of each individual sample inside the test chamber. This provides continuous and reliable data for analysis and prediction of LED lifespan. It does not require suspending the reliability test for sample inspection and can automatically analyze the time-to-failure of samples. The proposed system can significantly reduce the time required for data acquisition and measurement errors. This paper also compares the results obtained from the proposed system and the conventional periodic inspection to highlight the merits of the new system.
Keywords
light emitting diodes; photodetectors; reliability; LED lifespan; LED long-term reliability test; data acquisition; fully-automated low-cost real-time illuminance measurement system; measurement errors; periodic inspection; photodetector; proprietary algorithm; real-time monitoring system development; sample inspection; sample time-to-failure; sequential scanning; test chamber; time reduction; uniphotodetector; Abstracts; Decision support systems; IEEE standards; Light emitting diodes; Photonics; Real-time systems; Reliability; LED; illuminance; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922933
Filename
6922933
Link To Document