Intel enterprise server processor packaging challenge and future trend

Processor package has played significant role during Intel server´s historic path. From the early front side bus (FSB) interconnect with north bridge chipset to the current quick path interconnect (QPI), server package architecture and design have met the challenge at each step. This paper summarized what we have done to implement quad core multi-chip package with compatible platform, develop multi-package socket with compressed Hex pattern, implement air core inductor to support Fully Integrated Voltage Regulator (FIVR) and create the Patch on Interposer (PoINT) technology to meet the product need and still maintain the low cost. At the end, future Intel server challenge and trend is discussed.