R68-22 Current Status of Large Scale Integration Technology

This paper combines a useful review of progress during the past year, a description of present programs and immediate goals, and some forecasts of ultimate goals. Although the author, as director of Texas Instruments´ semiconductor research and development laboratories, deals primarily with programs and points of view at TI, he makes enough references to work at other companies to build up a reasonably comprehensive picture of the large-scale integration field. Four main areas are covered: bipolar chip technology, full-slice technology, MOS technology, and hybrid technology.