Evolution of ESD process capability in future electronic industry

The evolution in semiconductor and electronic packaging to fulfill mobility and miniaturization has drastically changed the nature of electronic industry. Electronic component are continuing to get more sensitive to EOS (electrical overstress) due to electrostatic Sensitivity, Although HBM (Human Body Model) for Electrostatic sensitive device (ESD) has not changed for the last two decades. In this article, the CDM (Charged Device Model) which is used in semiconductor device ESD sensitivity test will be explained for a potential situation where a semiconductor device is charged to a high voltage then discharged to a grounded surface. From the failure analysis data collected from the field in the past several years, it is clear that the number of failure caused by ESD has been increasing due to component electrostatic as sensitivity as 100V of CDM. It is perilous to find out the possible ESD source and risk in PCBA/SYS assembly process and make the corresponding remedy before the electronic board is build in the line. This article will give the general guideline to make this extended ESD control, and a working model will be developed to organize the mitigation plan and measures to be taken.