DocumentCode :
1193099
Title :
Application of eddy-current testing technique for high-density double-Layer printed circuit board inspection
Author :
Chomsuwan, K. ; Yamada, S. ; Iwahara, M. ; Wakiwaka, H. ; Shoji, S.
Author_Institution :
Inst. of Nature & Environ. Technol., Kanazawa Univ., Ishikawa, Japan
Volume :
41
Issue :
10
fYear :
2005
Firstpage :
3619
Lastpage :
3621
Abstract :
High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning.
Keywords :
eddy current testing; giant magnetoresistance; inspection; magnetic sensors; printed circuit testing; spin valves; ECT probe; eddy-current testing; high-density double-layer PCB; high-density double-layer printed circuit boards; planar meander exciting coil; printed circuit board inspection; spin-valve giant magnetoresistance sensor array; Circuit testing; Coils; Electrical capacitance tomography; Giant magnetoresistance; Inspection; Magnetic sensors; Printed circuits; Probes; Sensor arrays; Sensor phenomena and characterization; Eddy-current testing (ECT); inspection; printed circuit board (PCB); spin-valve giant magnetoresistance (SV-GMR);
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2005.855173
Filename :
1519389
Link To Document :
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