DocumentCode :
1193488
Title :
Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding
Author :
Geissler, U. ; Schneider-Ramelow, Martin ; Reichl, Herbert
Author_Institution :
Tech. Univ. Berlin, Berlin, Germany
Volume :
32
Issue :
4
fYear :
2009
Firstpage :
794
Lastpage :
799
Abstract :
Ultrasonic wedge-wedge bonding of 25- mum AlSi1 wires is characterized as a dynamic process of hardening and softening. In the first phase of wire bonding, the wedge is predeformed and cold worked by the bondforce. After ultrasonic energy has been switched on, recrystallization starts at the interface. During the bonding time hardening and softening processes alternate and a maximum in hardness is measured. Hardening and softening processes correlate well with the grain structure, the measured grain sizes and a typical plateau in the z-deformation curve of the contact. At the end of the wire bonding process the wedge is recrystallized and softer than the predeformated wedge, but harder than the as-received wire.
Keywords :
aluminium alloys; cold working; grain size; hardening; integrated circuit bonding; integrated circuit metallisation; lead bonding; mechanical contact; recrystallisation; silicon alloys; softening; ultrasonic bonding; AlSi; AlSi1 bond contacts; cold working; grain size; grain structure; hardening process; recrystallization; semiconductor chip bonding; size 25 mum; softening process; ultrasonic energy; ultrasonic wedge-wedge bonding; ultrasonic wire bonding; wire metallization; z-deformation curve; AlSi1; dynamic recrystallization; interface; microhardness; softening and hardening; ultrasonic wedge/wedge bonding;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2008.2009930
Filename :
4801566
Link To Document :
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