Electrodeposited Co-Ni-Re-W-P thick array of high vertical magnetic anisotropy

A magnetic material based on cobalt-nickel-rhenium-tungsten-phosphorus (Co-Ni-Re-W-P) composition has been developed by electrochemical deposition. With proper control of process conditions, hard magnetic films with high out-of-plane remanent magnetization (Mr) of 3.11 kG and coercivity (Hc) of 2.33 kOe are achieved. Fabrication of Co-Ni-Re-W-P in the form of microcylindrical arrays of ∼50 μm diameter and 90 μm height enhances the vertical anisotropy to a vertical Mr of 5.15 kG and Hc of 2.02 kOe. The materials and fabrication technique of microstructures as reported could be applied for the fabrication of magnetic microelectromechanical systems.