Title :
Design of low dielectric glass+ceramics for multilayer ceramic substrate
Author :
Jean, Jau-Ho ; Gupta, Tapan K.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fDate :
5/1/1994 12:00:00 AM
Abstract :
Compositional design and properties of a low dielectric constant glass+ceramics, containing borosilicate glass, high silica glass and alumina, for multilayer ceramic substrates are described. The new low dielectric system can be densified at below 1000°C in air, allowing high electrical conductivity metallization including Au and Ag-Pd. Compositions with tailor-made properties are designed according to a working model based upon mixing rule, and validated with experimental results. Compositions with a thermal expansion coefficient compatible with Si and GaAs, and a dielectric constant in the range of 4-4.5 and 5-6, respectively, are developed
Keywords :
alumina; borosilicate glasses; ceramics; composite materials; integrated circuit technology; packaging; permittivity; substrates; thermal expansion; 1000 C; AgPd; Al2O3; Au; B2O3-SiO2; BSG; MLC substrate; alumina; borosilicate glass; compositional modelling; glass/ceramics material composition; high electrical conductivity metallization; high silica glass; low dielectric constant; multilayer ceramic substrate; thermal expansion coefficient; Ceramics; Conductivity; Dielectric constant; Dielectric substrates; Glass; Gold; Metallization; Nonhomogeneous media; Silicon compounds; Thermal expansion;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
