Title :
Electromagnetic Considerations for Designing Double-Sided Power Modules
Author :
Mandray, Sylvain ; Guichon, Jean-Michel ; Schanen, Jean-Luc ; Guyennet, Michel Mermet ; Dienot, Jean-Marc
Author_Institution :
Grenoble Electr. Eng. Lab., St. Martin d´´Heres
Abstract :
Double-sided power modules are particularly attractive due to their high thermal performance. Thanks to the stacking of two direct bond coppers, very low stray inductances may be expected, particularly because of the proximity of the two rear metalizations. On the other hand, capacitive effects may be increased. In this paper, the complete electromagnetic behavior of double-sided power modules is studied, regarding both internal coupling and unwanted electromagnetic compatibility emissions. Some layout and active solutions are proposed to reduce common-mode emissions.
Keywords :
electromagnetic compatibility; hybrid integrated circuits; direct bond coppers; double-sided power modules; electromagnetic compatibility emissions; stray inductances; Bonding; Cooling; Electromagnetic compatibility; Electromagnetic coupling; Laboratories; Leg; Multichip modules; Power electronics; Power generation; Stacking; Electromagnetic compatibility; hybrid integrated circuit interconnections; hybrid integrated circuit packaging; power electronics; printed circuit layout;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2009.2013558