Thermal crisis: challenges and potential solutions

This paper describes integrated circuits (IC), which is denser, faster and cheaper. In the increasing system integration, as well as aggressive technology scaling, IC thermal issues now stand in the way of improved IC performance and by increasing transistors counts and aggressive frequency scaling result in as significant increase in chip-power density, and also its temperature. In order to avoid thermal crisis, we must simultaneously and cooperatively address thermal issues at each stage of the design process: during packaging and cooling design, architecture design, circuit design, fabrication and the development of novel devices