DocumentCode :
1219185
Title :
Boron penetration through gate oxide from decaborane gate electrode implantation
Author :
Bourdelle, K.K. ; Agarwal, Abhishek ; Perel, A.S.
Author_Institution :
Agere Syst., Orlando, FL, USA
Volume :
39
Issue :
10
fYear :
2003
fDate :
5/15/2003 12:00:00 AM
Firstpage :
807
Lastpage :
808
Abstract :
Boron penetration from the gate electrode into the Si substrate presents a significant problem in advanced PMOS device fabrication. It is known that hydrogen enhances B diffusion in silicon dioxide. It is shown that hydrogen from decaborane gate electrode implants also enhances boron penetration leading to a degradation of PMOS transistor parameters.
Keywords :
MOSFET; boron; diffusion; ion implantation; semiconductor device reliability; 0.16 micron; B penetration; B10H14; B10H14 gate electrode implantation; PMOS device fabrication; PMOS transistor parameter degradation; Si; Si substrate; Si:B-SiO2; decaborane gate electrode implants; dual-polysilicon W-polycide CMOS technology; gate electrode; gate oxide; hydrogen enhanced B diffusion;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20030521
Filename :
1204798
Link To Document :
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