Title :
Induction of internal capacitance effect of organic photovoltaic device (OPV) by Real-Time One-Sweep Method (RTOSM) in I–V measurement
Author :
Yean-San Long ; Shu-Tsung Hsu ; Yu-Tai Li ; Teng-Chun Wu
Author_Institution :
Center for Meas. Stand., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
The characterization related features in measuring I-V curves of DSSC are having different error compare to the conventional crystalline Si (c-Si) or amorphous silicon devices. These error sources include the sample area, spectral errors, temperature fluctuations, current and voltage response time, contacting, and degradation during testing. In addition to OPV characteristics requires additional considering the forward/backward sweep in I-V curves, but the related features in measuring I-V curves are more sensitive to temperature due to non-linear issue. Therefore, in this study, we aimed to develop a new real time one sweep method (RTOSM) and applied in I-V measurement to analysis different OPV materials, which are independent on setting delay time and the forward(F)/backward(B) sweep in I-V curves. A brief discussion of photovoltaic efficiency measurements and procedures was presented, and result showed final performance data of Pmax (Isc and Voc) having deviations 0.2 % or less.
Keywords :
solar cells; DSSC; I-V curve measurement; OPV characteristics; OPV materials; RTOSM; amorphous silicon devices; conventional crystalline silicon devices; current response time; forward-backward sweep; internal capacitance effect; organic photovoltaic device; photovoltaic efficiency measurements; real-time one-sweep method; sample area; setting delay time; spectral errors; temperature fluctuations; voltage response time; Area measurement; Capacitance; Capacitance measurement; Current measurement; Measurement uncertainty; Time measurement; Voltage measurement; characterization‥; one-sweep method performance; organic photovoltaic; real-time removing capacitance effect;
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
DOI :
10.1109/PVSC.2014.6925288