Title :
Analysis of the effects of end connection quality on the dielectric loss of metallized film capacitors
Author :
Qi, Xiaoguang ; Boggs, Steven
Author_Institution :
Dept. of Phys., Connecticut Univ., Storrs, CT, USA
Abstract :
Plasma sprayed metal end connections of metallized film capacitors are the weak link for pulse power applications which involve discharge times of tens of microseconds and less. This problem will only get worse with increased capacitor energy density. The present contribution quantifies the relationship between the "quality" of the end connection and dielectric loss of the capacitor winding. The analysis suggests that even for very poor end connections, the effect on dielectric loss of the total capacitor is relatively small. This makes a low stress production test for end connection quality problematic since such tests can only show the total capacitor dissipation factor resulting from various factors.
Keywords :
dielectric losses; electric resistance; finite element analysis; metallic thin films; metallisation; polymer films; stress effects; thin film capacitors; windings; capacitor dissipation factor; capacitor energy density; capacitor winding; dielectric loss; dissipation factor; end connection quality; equivalent series resistance; finite element analysis; metallized film capacitors; plasma spray; polypropylene; pulse power applications; stress; Capacitors; Dielectric breakdown; Dielectric losses; Dielectrics and electrical insulation; Finite element methods; Metallization; Physics; Polymer films; Testing; Thermal spraying;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2004.1387822