DocumentCode :
1219944
Title :
Optimizing the operation sequence of a chip placement machine using TSP model
Author :
Kumar, Ratnesh ; Luo, Zhonghui
Author_Institution :
Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
Volume :
26
Issue :
1
fYear :
2003
Firstpage :
14
Lastpage :
21
Abstract :
Surface mount component placement machines are being widely used in electronic manufacturing industry for automated placement of components on printed wire boards (PWBs). Their performance is determined by their board assembly time. Factors that determine this include the machine´s architecture and placement sequence algorithm, and component locations on the board. For a given machine and a board, the assembly time can be improved by optimizing the placement sequence algorithm. This paper presents a formulation and solution of the assembly time optimization problem for the FUJI FCP-IV component placement machine. The formulation gives a mathematical description of the assembly time that can be optimized as an integer programming problem. A near-optimal solution that can be obtained in a computationally efficient manner has been obtained by relaxing the problem to an instance of the traveling salesman problem (TSP). Simulation has been conducted on some actual boards and the results have been compared with those obtained by the actual runs at Lexmark, Inc., Lexington, KY. This shows that significant reduction in component placement time can be achieved by the proposed optimization algorithm.
Keywords :
assembling; integer programming; printed circuit manufacture; surface mount technology; travelling salesman problems; FUJI FCP-IV machine; PWBs; SMD placement; SMT placement machines; TSP; TSP model; automated placement; board assembly time; chip placement machine; component locations; component placement time reduction; electronic manufacturing; integer programming problem; operation sequence optimisation; placement sequence algorithm; printed wire boards; surface mount component placement; traveling salesman problem; Assembly; Computational modeling; Industrial electronics; Linear programming; Manufacturing industries; Packaging machines; Production; Surface-mount technology; Traveling salesman problems; Wire;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2003.813002
Filename :
1205218
Link To Document :
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