• DocumentCode
    122108
  • Title

    Current voltage analysis of silver nanoparticle doped organic photovoltaic devices

  • Author

    Murray, R. ; Rujisamphan, Nopporn ; Cramer, Harlan ; Ali, Shady ; Shah, S. Ismat

  • Author_Institution
    Univ. of Delaware, Newark, DE, USA
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Firstpage
    2570
  • Lastpage
    2574
  • Abstract
    Organic photovoltaic devices utilizing surfactant free thermally evaporated metallic nanoparticles to aid in light absorption were fabricated. These devices were characterized with a number of methods, including current voltage (JV) testing, UV-Vis spectroscopy, SEM, and AFM. The JV results were further analyzed using a simple lumped circuit model combined with a model to relate the carrier collection efficiency with the lifetime-mobility product. These findings indicated that while these nanoparticles did in fact increase the absorption, they suffered from high recombination that led to a decrease in the efficiency. The devices with nanoparticles located close to the electrodes had the highest recombination. Sandwiching the nanoparticles in the active layer proved useful in decreasing recombination and creating a well-functioning device.
  • Keywords
    atomic force microscopy; carrier lifetime; carrier mobility; light absorption; scanning electron microscopy; solar cells; ultraviolet spectroscopy; AFM; JV testing; SEM; UV-Vis spectroscopy; active layer; carrier collection efficiency; current voltage analysis; current voltage testing; lifetime-mobility product; light absorption; recombination; silver nanoparticle-doped organic photovoltaic devices; simple-lumped circuit model; surfactant-free thermally-evaporated metallic nanoparticles; well-functioning device; Absorption; Indium tin oxide; Materials; Nanoparticles; Photovoltaic cells; Photovoltaic systems; charge carrier lifetime; metallic nanoparticles; organic photovoltaics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925455
  • Filename
    6925455