Title :
In situ temperature measurement of a notebook computer - a case study in health and usage monitoring of electronics
Author :
Vichare, Nikhil ; Rodgers, Peter ; Eveloy, Valérie ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Univ. of Maryland, College Park, MD, USA
Abstract :
Reliability prediction methods do not generally account for the actual life cycle environment of electronic products, which covers their environmental, operating and usage conditions. Considering thermal loads, thermal management strategies still focus on a design for continuous operation that is often determined based on an accumulation of worst-case assumptions. Health monitoring is a method of assessing the reliability of a product in its actual application conditions. A case study in health and usage monitoring of electronic products is presented for a commercial notebook computer. Internal temperatures were dynamically monitored in situ and statistically analyzed during all phases of the life cycle, including usage, storage, and transportation. The effects of power cycles, usage history, CPU computing resources usage, and external thermal environment on peak transient thermal loads were characterized. Such monitored life cycle temperature data could be applied in a life consumption monitoring methodology, to provide damage estimation and remaining life prediction due to specific failure mechanisms influenced by temperature. These findings could contribute to the design of more sustainable, least-energy consumption thermal management solutions.
Keywords :
health hazards; human factors; notebook computers; reliability; temperature measurement; CPU computing resources usage; damage estimation; electronic products; electronics cooling; failure mechanisms; health monitoring; least-energy consumption thermal management; life consumption monitoring; life cycle environment; life cycle temperature; notebook computer; operating condition; peak transient thermal loads; power cycles; reliability prediction methods; remaining life prediction; temperature measurement; thermal characterization; thermal environment; thermal management strategy; usage conditions; usage history; usage monitoring; Application software; Computerized monitoring; Condition monitoring; Prediction methods; Temperature distribution; Temperature measurement; Temperature sensors; Thermal loading; Thermal management; Thermal management of electronics;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2004.838403