DocumentCode :
1225663
Title :
Sheet Resistance Determination Using Symmetric Structures With Contacts of Finite Size
Author :
Cornils, Martin ; Doelle, Michael ; Paul, Oliver
Author_Institution :
Univ. of Freiburg, Freiburg
Volume :
54
Issue :
10
fYear :
2007
Firstpage :
2756
Lastpage :
2761
Abstract :
This paper proposes an extension of van der Pauw´s celebrated method for the extraction of the sheet resistance Rsq of planar homogeneously conducting samples with four point-like contacts to symmetric samples with contacts of finite length. Using the method, Rsq can be extracted, e.g., from symmetric integrated Hall plates and stress sensors, without having to resort to dedicated van der Pauw structures. First, the analog of van der Pauw´s formula for arbitrarily shaped samples with four extended contacts separated by point-like insulations is derived. Based on this and van der Pauw´s original result, an interpolation formula applicable to symmetric samples with contacts of arbitrary length is constructed. The new formalism was successfully put to the test using ten widely differing CMOS sensor structures, with contacts covering between 10.1% and 91.3% of the device periphery. The extracted Rsq values lie within the range specified by the CMOS foundry used for the fabrication of the samples and show a relative standard deviation of 1.04%.
Keywords :
electric resistance measurement; electrical contacts; interpolation; semiconductor device measurement; CMOS sensor structures; finite size contacts; interpolation; planar homogeneously conducting of samples; point-like contacts; sheet resistance determination; symmetric structures; symmetrically shaped four-terminal devices; van der Pauw method; CMOS technology; Contact resistance; Electrical resistance measurement; Geometry; Insulation; Laboratories; Mechanical sensors; Stress; Testing; Voltage; Conformal mapping; device characterization; four-contact device; resistance measurement; sheet resistance; van der Pauw method;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.906219
Filename :
4317728
Link To Document :
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