Title :
Delay-Based Macromodeling of Long Interconnects From Frequency-Domain Terminal Responses
Author :
Chinea, Alessandro ; Triverio, Piero ; Grivet-Talocia, Stefano
Author_Institution :
Dept. of Electron., Politec. di Torino, Torino, Italy
Abstract :
We present a robust and efficient scheme for the generation of delay-based macromodels from frequency-domain tabulated responses. These responses can come from both simulation or direct measurement. The main algorithm is based on an iterative weighted least-squares process for the identification of delayed rational approximations. In case that pole relocation is performed during the iterations, the scheme can be interpreted as a generalization of the well-known vector fitting algorithm to delayed systems. Therefore, we denote this algorithm as delayed vector fitting (DVF). In case no pole relocation is performed, the scheme generalizes the so-called Sanathanan-Koerner iteration, calling for the denomination of delayed Sanathanan-Koerner algorithm. These techniques produce compact macromodels that are readily synthesized in SPICE-compatible equivalent circuits including delayed sources or ideal transmission line elements. These macromodels outperform classical rational macromodels in terms of simulation time. Several examples illustrate the advantages of proposed methodology.
Keywords :
SPICE; equivalent circuits; frequency-domain analysis; integrated circuit interconnections; iterative methods; least squares approximations; SPICE compatible equivalent circuits; Sanathanan-Koerner iteration; compact macromodels; delay based macromodeling; delayed rational approximation; delayed sources; delayed vector fitting; frequency domain tabulated responses; frequency domain terminal responses; ideal transmission line elements; iterative weighted least squares process; long interconnects; pole relocation; vector fitting algorithm; Delay extraction; high-speed interconnects; macromodeling; rational approximations; scattering parameters; transmission lines;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2008.2010525