DocumentCode :
1231466
Title :
Interconnect opportunities for gigascale integration
Author :
Meindl, James D.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
23
Issue :
3
fYear :
2003
Firstpage :
28
Lastpage :
35
Abstract :
During the past decade, interconnects have replaced transistors as the dominant determiner of chip performance. To sustain the historical rate of advance in performance, monolithic interconnect technology has rapidly evolved to keep pace with advances in transistor density and performance. New and radically different interconnect technologies will become increasingly important to future gigascale microsystems.
Keywords :
integrated circuit interconnections; integrated optics; network routing; system-on-chip; technological forecasting; 3D integration; gigascale integration; microphotonics; monolithic interconnect technology; multilevel interconnect network; polylithic integration; reverse scaling; system on chip; transistor density; Aluminum; Clocks; Delay; Energy dissipation; Integrated circuit interconnections; MOSFET circuits; Power system interconnection; Transistors; Ultra large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.2003.1209464
Filename :
1209464
Link To Document :
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