DocumentCode :
1233164
Title :
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
Volume :
27
Issue :
3
fYear :
2004
fDate :
7/1/2004 12:00:00 AM
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.844602
Filename :
1393078
Link To Document :
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