• DocumentCode
    1241668
  • Title

    Templated Self-Assembly Over Patterned Electrodes by an Applied Electric Field: Geometric Constraints and Diversity of Materials

  • Author

    Winkleman, Adam ; McCarty, Logan S. ; Zhu, Ting ; Weibel, Douglas B. ; Suo, Zhigang ; Whitesides, George M.

  • Author_Institution
    Dept. of Chem. & Chem. Biol., Harvard Univ., Cambridge, MA
  • Volume
    17
  • Issue
    4
  • fYear
    2008
  • Firstpage
    900
  • Lastpage
    910
  • Abstract
    This paper expands the scope and usefulness of a process to assemble dry micrometer-sized particles into arrays over a templated electrode by a high-voltage dc bias. Using the predictions from a theoretical model for the process of assembly, the experimental scope and limitations of this technique were explored and related to the predictions of the model. The range of bead size that can be assembled (20-750 mum) and the effects of changing the ratio of the size of the features in the templated electrode to the size of the particles being assembled were experimentally determined and compared to the theory. It was also demonstrated that: 1) the assembled spheres can be made of materials that are either dielectrics (glass and polystyrene), semiconductors (silicon), or conductors (copper); 2) the material for the electrode can either be gold, silver, copper, or amorphous silicon; and 3) the dielectric substrate only needs to be able to support the applied voltage without breaking down. The experimental results, in general, were predicted and supported by the model.
  • Keywords
    arrays; copper; dielectric materials; elemental semiconductors; glass; micromechanical devices; polymers; self-assembly; silicon; Ag; Au; Cu; Si; SiO2; amorphous silicon substrate; bead size; dielectric materials; dielectric polystyrene; dielectrics glass; dry micrometer-sized particle array; high-voltage dc bias; metal conductors; patterned electrode; semiconductors; templated self-assembly; Microassembly;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2008.922079
  • Filename
    4538252