DocumentCode :
1244126
Title :
Reliability aspects of packaging and integration technology for microfluidic systems
Author :
Han, Ki-Ho ; Frazier, A. Bruno
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
5
Issue :
3
fYear :
2005
Firstpage :
452
Lastpage :
457
Abstract :
This paper presents the reliability aspects of an integrated microfluidic-system-interface (MSI) technology for complex microfluidic systems. MSI technology provided three primary functional interface components: microfluidic interconnects, integrated microvalves, and optical windows. The microfluidic interconnects were designed to facilitate complex micro-to-macro fluid interfacing between the microsystem and the macro world in a single package. The functionality and reliability of the fluid interconnects were tested using standard capillary tubing. The pneumatic microvalves were integrated directly into the microfluidic interface. The valve leak-rate characteristics and the bonding stability between the integrated microfluidic interface and the microfluidic system were tested against the pneumatic-valve pressure. Use of the optical windows in the interface was demonstrated by enabling an on-chip infrared polymerase-chain-reaction (PCR) process. This paper demonstrates the use of MSI technology as a facile and reliable interface/packaging method for a complex microfluidic system.
Keywords :
electronics packaging; microfluidics; microvalves; reliability; capillary tubing; integrated microfluidic system interface technology; integrated microvalves; microfluidic interconnects; optical windows; packaging reliability; pneumatic microvalves; polymerase chain reaction process; valve pressure; Bonding; Integrated optics; Microfluidics; Microvalves; Optical devices; Optical interconnections; Optical polymers; Packaging; Testing; Valves; Microfluidic-system-interface (MSI); microvalves; packaging;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2005.856470
Filename :
1545907
Link To Document :
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