DocumentCode
1244210
Title
Scanning laser ultrasonics experiments for in situ nondestructive analysis of integrated circuits
Author
Andriamonje, Grégory ; Pouget, Vincent ; Ousten, Yves ; Lewis, Dean ; Plano, Bernard ; Danto, Yves
Author_Institution
IXL Microelectron. Lab., Bordeaux Univ., Talence, France
Volume
5
Issue
3
fYear
2005
Firstpage
564
Lastpage
571
Abstract
Scanning experiments on a very large scale integrated (VLSI) circuit are presented using the picosecond ultrasonics technique. This optical nondestructive technique is based on ultrasound generation and detection by ultrashort laser pulses. The experimental setup and methodology are described. The influence of the protection layer for passivated circuits on the experimental results is described and illustrated by experimental data. In order to help in the interpretation of the experimental analysis of microelectronic devices, a simulation tool was developed.
Keywords
VLSI; high-speed optical techniques; integrated circuit reliability; integrated circuit testing; materials testing; measurement by laser beam; photoacoustic effect; ultrasonic materials testing; integrated circuit reliability; microelectronic devices; optical nondestructive technique; passivated circuits; picosecond ultrasonics technique; protection layer; scanning laser ultrasonics; ultrafast optics; ultrashort laser pulses; ultrasound generation; very large scale integrated circuits; Circuit analysis; Frequency; Laser theory; Optical films; Optical pulse generation; Pulse measurements; Pump lasers; Ultrasonic imaging; Ultrasonic variables measurement; Very large scale integration; Acoustics; integrated circuit reliability; ultrafast optics;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2005.853576
Filename
1545920
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