• DocumentCode
    1244244
  • Title

    13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

  • Volume
    5
  • Issue
    3
  • fYear
    2005
  • Firstpage
    613
  • Lastpage
    613
  • Abstract
    Describes the above-named upcoming conference event. May include topics to be covered or calls for papers.
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2005.862048
  • Filename
    1545925
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1244244