Title :
SOI single-electron transistor with low RC delay for logic cells and SET/FET hybrid ICs
Author :
Park, Kyu-Sul ; Kim, Sang-Jin ; Baek, In-Bok ; Lee, Won-Hee ; Kang, Jong-Seuk ; Jo, Yong-Bum ; Lee, Sang Don ; Lee, Chang-Keun ; Choi, Jung-Bum ; Kim, Jang-Han ; Park, Keun-Hyung ; Cho, Won-Ju ; Jang, Moon-Gyu ; Lee, Seong-Jae
Author_Institution :
Memory Div., Samsung Electron. Co. Ltd., Hwasung, South Korea
fDate :
3/1/2005 12:00:00 AM
Abstract :
We report on a successful fabrication of silicon-based single-electron transistors (SETs) with low RC time constant and their applications to complementary logic cells and SET/field-effect transistor (FET) hybrid integrated circuit. The SETs were fabricated on a silicon-on-insulator (SOI) structure by a pattern-dependent oxidation (PADOX) technique, combined with e-beam lithography. Drain conductances measured at 4.2 K approach large values of the order of microsiemens, exhibiting Coulomb oscillations with peak-to-valley current ratios ≫1000. Data analysis with a probable mechanism of PADOX yields their intrinsic speeds of ∼ 2 THz, which is within an order of magnitude of the theoretical quantum limit. Incorporating these SETs as basic elements, in-plane side gate-controlled complementary logic cells and SET/FET hybrid integrated circuits were fabricated on an SOI chip. Such an in-plane structure is very efficient in the Si fabrication process, and the side gates adjacent to the electron island could easily control the phase of Coulomb oscillations. The input-output voltage transfer, characteristic of the logic cell, shows an inverting behavior where the output voltage gain is estimated to be about 1.2 at 4.2 K. The SET/FET hybrid integrated circuit consisting of one SET and three FETs yields a high-voltage gain and power amplification with a wide-range output window for driving the next circuit. The small SET input gate voltage of 30 mV is finally converted to 400 mV, corresponding to an amplification ratio of 13.
Keywords :
Coulomb blockade; electron beam lithography; elemental semiconductors; field effect integrated circuits; field effect logic circuits; field effect transistors; hybrid integrated circuits; oxidation; silicon; silicon-on-insulator; single electron transistors; submillimetre wave integrated circuits; submillimetre wave transistors; very high speed integrated circuits; 1.2 dB; 2 THz; 30 mV; 4.2 K; 400 mV; Coulomb oscillations; RC delay; RC time constant; SOI single electron transistor; Si; Si fabrication process; amplification ratio; drain conductances; driving circuits; e-beam lithography; electron island; field effect transistor hybrid IC; high voltage gain amplification; in-plane side gate controlled complementary logic cells; input output voltage transfer; inverting property; microsiemens order; pattern dependent oxidation method; peak to valley current ratios; power amplification; silicon-on-insulator structure; single electron transistor hybrid integrated circuit; theoretical quantum limit; wide range output window; Delay; FETs; Fabrication; Hybrid integrated circuits; Integrated circuit yield; Logic circuits; Oxidation; Silicon on insulator technology; Single electron transistors; Voltage; Pattern-dependent oxidation (PADOX); SET-logic cells; peak-to-valley current ratio (PVCR); silicon-on-insulator; single-electron transistor; single-electron transistor (SET)/field-effect transistor (FET) hybrid integrated circuits (ICs); terahertz intrinsic speed;
Journal_Title :
Nanotechnology, IEEE Transactions on
DOI :
10.1109/TNANO.2004.837857