• DocumentCode
    125077
  • Title

    The influence of MEMS on electromagnetic NDT

  • Author

    Mengchun Pan ; Yunze He ; Ruifang Xie ; Weihong Zhou

  • Author_Institution
    Coll. of Mechatron. Eng. & Autom., Nat. Univ. of Defense Technol., Changsha, China
  • fYear
    2014
  • fDate
    20-23 June 2014
  • Firstpage
    363
  • Lastpage
    367
  • Abstract
    There are some challenges in Electromagnetic Nondestructive Testing (EM NDT) techniques. Micro cracks are too small to find and evaluate at the beginning. Complex components are hardly to inspect. The volumetric sensor is difficult to be embedded in the structures. To solve these problems, Micro-Electro-Mechanical Systems (MEMS) was presented to fabricate micro inductive coils as eddy current sensor. With the help of rapid development of MEMS, a lot of merits are brought to EM sensors, like high spatial resolution, high sensitivity, be adapted to complex structure, flexible substrate, be easily embedded, and on-chip integration. This paper reviews the influences of MEMS on EM sensors and introduces some classical methodologies to fabricate and develop EM sensors.
  • Keywords
    coils; eddy current testing; microcracks; microfabrication; micromechanical devices; EM sensors; MEMS; classical methodology; complex structure; eddy current sensor; electromagnetic NDT; electromagnetic nondestructive testing techniques; high spatial resolution; microcracks; microelectromechanical systems; microinductive coils; on-chip integration; volumetric sensor; Coils; Eddy currents; Educational institutions; Fabrication; Micromechanical devices; Silicon; Substrates; MEMS; eddy current; electromangetic NDT; flexiable; inductive coil;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-4731-7
  • Type

    conf

  • DOI
    10.1109/FENDT.2014.6928297
  • Filename
    6928297