DocumentCode
125077
Title
The influence of MEMS on electromagnetic NDT
Author
Mengchun Pan ; Yunze He ; Ruifang Xie ; Weihong Zhou
Author_Institution
Coll. of Mechatron. Eng. & Autom., Nat. Univ. of Defense Technol., Changsha, China
fYear
2014
fDate
20-23 June 2014
Firstpage
363
Lastpage
367
Abstract
There are some challenges in Electromagnetic Nondestructive Testing (EM NDT) techniques. Micro cracks are too small to find and evaluate at the beginning. Complex components are hardly to inspect. The volumetric sensor is difficult to be embedded in the structures. To solve these problems, Micro-Electro-Mechanical Systems (MEMS) was presented to fabricate micro inductive coils as eddy current sensor. With the help of rapid development of MEMS, a lot of merits are brought to EM sensors, like high spatial resolution, high sensitivity, be adapted to complex structure, flexible substrate, be easily embedded, and on-chip integration. This paper reviews the influences of MEMS on EM sensors and introduces some classical methodologies to fabricate and develop EM sensors.
Keywords
coils; eddy current testing; microcracks; microfabrication; micromechanical devices; EM sensors; MEMS; classical methodology; complex structure; eddy current sensor; electromagnetic NDT; electromagnetic nondestructive testing techniques; high spatial resolution; microcracks; microelectromechanical systems; microinductive coils; on-chip integration; volumetric sensor; Coils; Eddy currents; Educational institutions; Fabrication; Micromechanical devices; Silicon; Substrates; MEMS; eddy current; electromangetic NDT; flexiable; inductive coil;
fLanguage
English
Publisher
ieee
Conference_Titel
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location
Chengdu
Print_ISBN
978-1-4799-4731-7
Type
conf
DOI
10.1109/FENDT.2014.6928297
Filename
6928297
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