DocumentCode :
125077
Title :
The influence of MEMS on electromagnetic NDT
Author :
Mengchun Pan ; Yunze He ; Ruifang Xie ; Weihong Zhou
Author_Institution :
Coll. of Mechatron. Eng. & Autom., Nat. Univ. of Defense Technol., Changsha, China
fYear :
2014
fDate :
20-23 June 2014
Firstpage :
363
Lastpage :
367
Abstract :
There are some challenges in Electromagnetic Nondestructive Testing (EM NDT) techniques. Micro cracks are too small to find and evaluate at the beginning. Complex components are hardly to inspect. The volumetric sensor is difficult to be embedded in the structures. To solve these problems, Micro-Electro-Mechanical Systems (MEMS) was presented to fabricate micro inductive coils as eddy current sensor. With the help of rapid development of MEMS, a lot of merits are brought to EM sensors, like high spatial resolution, high sensitivity, be adapted to complex structure, flexible substrate, be easily embedded, and on-chip integration. This paper reviews the influences of MEMS on EM sensors and introduces some classical methodologies to fabricate and develop EM sensors.
Keywords :
coils; eddy current testing; microcracks; microfabrication; micromechanical devices; EM sensors; MEMS; classical methodology; complex structure; eddy current sensor; electromagnetic NDT; electromagnetic nondestructive testing techniques; high spatial resolution; microcracks; microelectromechanical systems; microinductive coils; on-chip integration; volumetric sensor; Coils; Eddy currents; Educational institutions; Fabrication; Micromechanical devices; Silicon; Substrates; MEMS; eddy current; electromangetic NDT; flexiable; inductive coil;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-4731-7
Type :
conf
DOI :
10.1109/FENDT.2014.6928297
Filename :
6928297
Link To Document :
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