DocumentCode :
1251766
Title :
Parallel Heterogeneous Integration of Chip-Scale Parts by Self-Assembly
Author :
Park, Kwang Soon ; Hoo, Ji Hao ; Baskaran, Rajashree ; Böhringer, Karl F.
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Volume :
21
Issue :
6
fYear :
2012
Firstpage :
1273
Lastpage :
1275
Abstract :
This letter reports a novel methodology for the orientation-specific parallel heterogeneous integration of parts of various sizes. Assembly sites are designed to only attract specific parts from an unsorted pool using the combined effect of Faraday waves and magnetic forces, achieving one-to-one part-to-site registration. We demonstrate the assembly of two types of thin parts (2000 × 2000 × 100 and 4000 × 4000 × 100 μm3) onto the same substrate through a one-step process. Statistical analysis of the distributions of magnetic forces delimits the suitable range for the strength of Faraday waves to fix nonoptimal initial placements and orientations.
Keywords :
self-assembly; statistical analysis; system-in-package; Faraday waves; assembly sites; chip scale parts; magnetic force; nonoptimal initial placement; orientation specific parallel heterogeneous integration; self assembly; statistical analysis; unsorted pool; Assembly; Magnetic forces; Magnetic liquids; Self-assembly; Substrates; Directed self-assembly; fluidic self-assembly (FSA); heterogeneous system integration; orientation specific; packaging; self-assembly;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2012.2205905
Filename :
6249711
Link To Document :
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