DocumentCode :
1253871
Title :
Integrated circuit packaging industry in Taiwan
Author :
Lo, Choung-Lin ; Tung, Li-Rong
Author_Institution :
Mater. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Volume :
20
Issue :
4
fYear :
1997
fDate :
10/1/1997 12:00:00 AM
Firstpage :
243
Lastpage :
255
Abstract :
The integrated circuit (IC) industry in Taiwan is comprised mainly of IC chip design and fabrication, IC packaging, and system product design and fabrication industries. Fueled by rapid investment and development efforts from government and private sectors, this industry has sustained a rapid growth in recent years becoming one of the most profitable industries among Asian Pacific countries. This paper details Taiwan´s IC packaging manufacturing capabilities and its technology trends. It describes the Taiwan IC package industry´s ability to maintain favorable competitive leverage in the global business environment. This paper concentrates on two key areas of manufacturing and technology trends to illustrate Taiwan´s electronic industry in general: chip-level packages and substrate and its assembly. The requirements for different applications in the future packages are discussed. The reason for the packaging paradigm shifts and associated precautions are also explained
Keywords :
electronics industry; integrated circuit packaging; Asian Pacific country; Taiwan; assembly; chip-level package; electronic industry; global business environment; integrated circuit packaging; manufacturing; substrate; technology; Chip scale packaging; Electronics packaging; Fabrication; Government; Integrated circuit packaging; Investments; Manufacturing industries; Product design; Pulp manufacturing; Textile industry;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher :
ieee
ISSN :
1083-4400
Type :
jour
DOI :
10.1109/3476.650952
Filename :
650952
Link To Document :
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