DocumentCode
1255464
Title
Corrosion criteria for electronic packaging. III. Corrosion by package family
Author
Hoge, Carl E.
Author_Institution
Western Digital Corp., Irvine, CA, USA
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
1105
Lastpage
1109
Abstract
For pt.II see ibid., p.1098-104, Dec. 1990. The reaction path for catastrophic corrosion requires both condensed moisture and ionic contamination. It is shown here that package types ranging from hermetic ceramic to plastic cavity can be configured reliably as long as materials and assembly methods do not result in the presence of both condensed moisture and ionic contamination on the surface of the encased silicon chip
Keywords
corrosion; integrated circuit technology; metallisation; packaging; IC; Si; catastrophic corrosion; condensed moisture; electronic packaging; encased silicon chip; hermetic ceramic; integrated circuits; ionic contamination; metallisation; package types; plastic cavity; Aluminum; Contamination; Corrosion; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Moisture; Plastics; Polymers; Silicon;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62556
Filename
62556
Link To Document