DocumentCode :
1256048
Title :
Fully integrated CMOS power amplifier design using the distributed active-transformer architecture
Author :
Aoki, Ichiro ; Kee, Scott D. ; Rutledge, David B. ; Hajimiri, Ali
Author_Institution :
California Inst. of Technol., Pasadena, CA, USA
Volume :
37
Issue :
3
fYear :
2002
fDate :
3/1/2002 12:00:00 AM
Firstpage :
371
Lastpage :
383
Abstract :
A novel on-chip impedance matching and power-combining method, the distributed active transformer is presented. It combines several low-voltage push-pull amplifiers efficiently with their outputs in series to produce a larger output power while maintaining a 50-Ω match. It also uses virtual ac grounds and magnetic couplings extensively to eliminate the need for any off-chip component, such as tuned bonding wires or external inductors. Furthermore, it desensitizes the operation of the amplifier to the inductance of bonding wires making the design more reproducible. To demonstrate the feasibility of this concept, a 2.4-GHz 2-W 2-V truly fully integrated power amplifier with 50-Ω input and output matching has been fabricated using 0.35-μm CMOS transistors. It achieves a power added efficiency (PAE) of 41 % at this power level. It can also produce 450 mW using a 1-V supply. Harmonic suppression is 64 dBc or better. This new topology makes possible a truly fully integrated watt-level gigahertz range low-voltage CMOS power amplifier for the first time
Keywords :
CMOS analogue integrated circuits; UHF integrated circuits; UHF power amplifiers; impedance convertors; impedance matching; integrated circuit design; network topology; power combiners; 0.35 micron; 1 W; 2 V; 2 W; 2.4 GHz; 41 percent; 450 mW; CMOS power amplifier design; bonding wire inductance; circular geometry; distributed active-transformer architecture; fully integrated power amplifier; harmonic suppression; impedance transformation; input matching; integrated watt-level gigahertz range low-voltage CMOS power amplifier; low-voltage push-pull amplifiers; magnetic couplings; on-chip impedance matching; output matching; power added efficiency; power combining method; topology; virtual ac grounds; Bonding; Couplings; Distributed amplifiers; Impedance matching; Inductance; Inductors; Operational amplifiers; Power amplifiers; Power generation; Wires;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/4.987090
Filename :
987090
Link To Document :
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