Title :
Benchmark of power packaging for DC/DC and AC/DC converters
Author :
Cheasty, Philip ; Flannery, John ; Meinhardt, Mike ; Alderman, Arnold ; O´Mathuna, Sean Cian
Author_Institution :
Nat. Microelectron. Res. Centre, PEI Technol., Cork, Ireland
fDate :
1/1/2002 12:00:00 AM
Abstract :
This paper presents the first reported final results of a benchmarking project "StatPEP" which investigated the Status of Power Electronic Packaging used in commercial DC/DC and AC/DC switch mode power supplies. The methodology of the project is first described. Some of the salient results of a comprehensive benchmarking of DC/DC converters (rated power of 100 W) and AC/DC converters (rated power up to 576 W) are presented. Examples for figures-of-merit are presented. The results of the investigation are presented in a generic form, which does not identify individual products. A comparison of the performance of the units shows that the measured power density of the AC/DC units is approximately 10% that of the DC/DC while the thermal density based on footprint is 50%. Also the switching frequency of the AC/DC is 50% that of the DC/DC. Some of the reasons for these differences are discussed
Keywords :
AC-DC power convertors; DC-DC power convertors; packaging; switched mode power supplies; 100 W; 576 W; AC/DC converters; DC/DC converters; StatPEP benchmarking project; figures-of-merit; measured power density; power electronic packaging; switch mode power supplies; switching frequency; thermal density; Best practices; DC-DC power converters; Driver circuits; Electronic packaging thermal management; Electronics industry; Electronics packaging; Manufacturing; Power electronics; Power supplies; Switches;
Journal_Title :
Power Electronics, IEEE Transactions on
