Semiconductor reliability using random and wearout failure models

A new research project is developing a simple reliability prediction methodology for random failure rate and the time to intrinsic wearout. The models to be incorporated account for the latest advancement of the semiconductor technology and take into consideration the latest research in reliability assessment. Using common physics of failure (PoF) models for both intrinsic wearout and random failures, the project will seek data and analysis from semiconductor manufacturers, leaving most of the proprietary details to them, and only use the models to scale results between use conditions. This paper describes a methodology that is currently in development and not yet produced. Development of the models is based on aerospace industry collaboration and data from semiconductor manufacturers and foundries.