• DocumentCode
    1276261
  • Title

    Modeling resonance tests for electrostrictive ceramics

  • Author

    Hom, Craig L. ; Shankar, Natarajan

  • Author_Institution
    Adv. Technol. Center, Lockheed Martin Missiles & Space, Palo Alto, CA, USA
  • Volume
    46
  • Issue
    6
  • fYear
    1999
  • Firstpage
    1422
  • Lastpage
    1430
  • Abstract
    The electromechanical coupling coefficient represents a useful figure-of-merit for comparing the quality of different electroactive materials. However, the coupling coefficient for an electrostrictive ceramic is not a unique material parameter, because it depends strongly on the applied DC bias field, AC field amplitude and frequency, and stress. These dependencies make direct comparison between electrostrictors and piezoelectrics somewhat ambiguous. In this paper, we developed a pair of coupling parameters for electrostrictors that were strictly material constants and completely characterized the material´s electromechanical quality. We proposed relatively simple, inexpensive resonance testing to measure these new parameters from the electrical admittance of a vibrating electrostrictive rod. The electromechanical coupling coefficient for a specific loading condition is computed from these parameters, allowing direct comparison between electrostrictive and piezoelectric materials.
  • Keywords
    electric actuators; electrostriction; ferroelectric ceramics; lead compounds; AC field amplitude; DC bias field; PbMgO/sub 3/NbO/sub 3/-PbTiO/sub 3/; coupling parameters; electrical admittance; electromechanical coupling coefficient; electromechanical quality; electrostrictive ceramics; loading condition; material constants; resonance tests; vibrating electrostrictive rod; Admittance measurement; Ceramics; Electric variables measurement; Electrostriction; Frequency; Piezoelectric materials; Resonance; Stress; Testing; Vibration measurement;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/58.808865
  • Filename
    808865