DocumentCode
1278673
Title
Investigation of silicon sensor quality as a function of the ohmic side processing technology
Author
Bloch, P. ; Cheremukhin, A. ; Golubkov, S. ; Golutvin, I. ; Egorov, N. ; Konjkov, K. ; Kozlov, Y. ; Peisert, A. ; Sidorov, A. ; Zamiatin, N.
Author_Institution
CERN, Geneva, Switzerland
Volume
49
Issue
1
fYear
2002
fDate
2/1/2002 12:00:00 AM
Firstpage
321
Lastpage
325
Abstract
Silicon sensors designed for the CMS preshower detector must have a high breakdown voltage in order to be fully efficient after irradiation to 2×1014 n/cm2 expected during the ten years of Large Hadron Collider operation (CMS ECAL Group, Bloch et al.). Studies made by several groups (Bischoff et al., Evensen et al., Da Rold et al., Passeri et al., Li et al., Militaru et al.) have underlined the importance of the p+ side geometrical parameters, such as the metal width and the number and spacing of guard rings. We have in addition investigated the effects related to the ohmic side processing and found that the breakdown voltage depends strongly on the thickness of the effective "dead" n+ layer. By increasing this thickness from 1 to 2.5 μm, the fraction of sensors with breakdown voltage higher than 500 V increased from 22% to more than 80%. In addition, a thick n+ layer protects against defects caused by the technological treatment during detector production and assembly
Keywords
electric breakdown; ohmic contacts; silicon radiation detectors; 1 to 2.5 micron; CMS preshower detector; Si; Si detectors; breakdown voltage; ohmic contact; ohmic side processing technology; sensor quality; Atomic measurements; Chemical sensors; Collision mitigation; Detectors; Large Hadron Collider; Leakage current; Production; Protection; Silicon; Space technology;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2002.998662
Filename
998662
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