RFIP method: Towards a better characterization of integrated circuits immunity

Author

Ayed, A. ; Dubois, T. ; Levant, J.-L. ; Duchamp, G.

Author_Institution

IMS Lab., Univ. of Bordeaux, Talence, France

fYear

2014

fDate

1-4 Sept. 2014

Firstpage

686

Lastpage

691

Abstract

This paper presents an evolution of a conducted immunity measurement technique for integrated circuits: the Resistive RF Injection Probe (RFIP) test method. This method complements the Direct Power Injection (DPI) method by giving different immunity parameters (voltage, current, impedance, power). After a brief description of the method, immunity parameters computation is detailed and both RFIP probe and test bench are characterized. Immunity parameters calculation model is then verified by implementing a virtual test bench using simulation. Finally, RFIP immunity measurements on a microcontroller´s embedded analog to digital converter (ADC) are carried out and compared to DPI and Vector Network Analyzer (VNA) results.

Keywords

analogue-digital conversion; benchmark testing; electromagnetic compatibility; immunity testing; integrated circuit measurement; integrated circuit testing; radiofrequency integrated circuits; ADC; DPI method; RFIP method; VNA; analog to digital converter; direct power injection method; immunity measurement technique; immunity parameters calculation model; integrated circuits immunity; resistive RF injection probe test method; vector network analyzer; virtual test bench; Immunity testing; Impedance; Impedance measurement; Probes; Scattering parameters; Transmission line measurements; Voltage measurement; DPI; immunity measurement RFIP; integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on

Conference_Location

Gothenburg

Type

conf

DOI

10.1109/EMCEurope.2014.6930992

Filename

6930992