Circuit modelling of printed circuit boards for a DC-DC converter design

Author

Blecic, Raul ; Gillon, Renaud ; Nauwelaers, B. ; Baric, Adrijan

Author_Institution

Fac. of Electr. Eng. & Comput., Univ. of Zagreb, Zagreb, Croatia

fYear

2014

fDate

1-4 Sept. 2014

Firstpage

745

Lastpage

750

Abstract

In this paper a SPICE-compatible distributed circuit modelling method is applied to the modelling of printed circuit boards (PCBs) typically found in a DC-DC converter design. The method consists of identifying each pair of parallel plates present in a PCB and modelling it by a two-dimensional array of lossy transmission line elements. The impedance profile of the PCB is simulated in SPICE. The simulation results of the distributed circuit model are validated by comparing them to the simulation results obtained from a commercial electromagnetic (EM) solver. The presented method enables a fast and numerically efficient design, analysis and optimization of PCBs for DC-DC converters.

Keywords

DC-DC power convertors; SPICE; printed circuit design; DC-DC converter design; PCB modelling; SPICE-compatible distributed circuit modelling method; commercial electromagnetic solver; impedance profile; lossy transmission line elements; parallel plates; printed circuit boards modelling; two-dimensional array; Capacitance; Capacitors; DC-DC power converters; Impedance; Inductance; Integrated circuit modeling; Substrates; SPICE-compatible model; impedance profile; irregularly shaped multi-layered boards; loop inductance; two-dimensional array of lossy transmission line elements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on

Conference_Location

Gothenburg

Type

conf

DOI

10.1109/EMCEurope.2014.6931003

Filename

6931003