Title :
Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing
Author :
Daito, M. ; Nakata, Y. ; Sasaki, Seishi ; Gomyo, H. ; Kusamitsu, H. ; Komoto, Y. ; Iizuka, Kunihiko ; Ikeuchi, Katsushi ; Gil Su Kim ; Takamiya, Makoto ; Sakurai, Takayasu
Author_Institution :
Assoc. of Super-Adv. Electron. Technol. (ASET), Yokohama, Japan
Abstract :
A capacitively coupled probing circuit with a novel de-skewer, a low-pass filter and a high-sensitivity receiver is proposed to realize a membrane-based wafer-level simultaneous testing robustly. The de-skewer can be designed by only digital core transistors and has stable feed-forward architecture. The receiver with the low-pass filter can suppress the undesirable ringing caused by the complex wiring structure in the probe card. A probe chip and a 300 mm DUT-wafer are fabricated in a 1.2 V 90 nm technology and the measured power consumption of RX core is 0.5 mW at 1 Gbps operation. The BER is improved below 10-12 over almost all UI range when the de-skewing function is turned on.
Keywords :
integrated circuit testing; test equipment; DUT-wafer; RX core power consumption; capacitively coupled noncontact probing circuits; complex wiring structure; de-skewing function; digital core transistors; high-sensitivity receiver; low-pass filter; membrane-based wafer-level simultaneous testing; novel de-skewer; probe card; probe chip; stable feed-forward architecture; Couplings; Delay; Polyimides; Probes; Receivers; Switches; Testing; Capacitive coupling; crosstalk; de-skewer; receiver; wafer test;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2011.2160790
