DocumentCode :
1289369
Title :
A three-step method for the de-embedding of high-frequency S-parameter measurements
Author :
Cho, Hanjin ; Burk, Dorothea E.
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Volume :
38
Issue :
6
fYear :
1991
fDate :
6/1/1991 12:00:00 AM
Firstpage :
1371
Lastpage :
1375
Abstract :
The authors propose a general method of deembedding S-parameter measurements of the device-under-test (DUT) for which typical parasitics associated with probe pads and interconnect-metal lines can be deembedded from the measurement. The DUT is the analog silicon bipolar junction transistor including the pad and interconnects. This method includes the subtraction of the parasitic shunt y-parameters of the on-wafer open calibration pattern as well as the subtraction of the parasitic series z-parameters on the on-wafer open circuit which are taken from measurements of the short and through circuits. It is demonstrated that the calculated power loss for the pad and interconnect parasitics can be comparable to the power consumption of the advanced bipolar transistor at high frequencies (⩾10 GHz). A knowledge of the magnitude and type of parasitic deembedding circuit elements can aid the device engineer in the analysis of the error associated with deembedding
Keywords :
S-parameters; bipolar transistors; elemental semiconductors; microwave measurement; semiconductor device models; silicon; solid-state microwave devices; analog Si bipolar transistor; deembedding S-parameter measurements; device-under-test; high-frequency S-parameter measurements; interconnect parasitics; interconnect-metal lines; on-wafer open calibration pattern; on-wafer open circuit; pad parasitics; parasitic deembedding circuit elements; parasitic series z-parameters; parasitic shunt y-parameters; probe pads; three-step method; Bipolar transistors; Calibration; Energy consumption; Frequency; Integrated circuit interconnections; Knowledge engineering; Power engineering and energy; Probes; Scattering parameters; Silicon;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.81628
Filename :
81628
Link To Document :
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