• DocumentCode
    128958
  • Title

    Full-scale whole device EMC/MD simulation of Si nanowire transistor including source and drain regions by utilizing graphic processing units

  • Author

    Suzuki, A. ; Watanabe, Toshio ; Kamakura, Yoshinari ; Kamioka, Takefumi

  • Author_Institution
    Fac. of Sci. & Eng., Waseda Univ., Tokyo, Japan
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    357
  • Lastpage
    360
  • Abstract
    We have realized the full-scale whole device EMC/MD simulation including source and drain regions by utilizing graphic processing unit. The transfer characteristic of a gate-all-around nanowire Si MOSFET is simulated by reproducing the field effect of the surrounding gate electrode with spreading charged particles on the gate insulator layer. We have found an appreciable impact of the random dopant distribution (RDF) in source and drain regions on the drain current variability. Furthermore, the dynamic fluctuation of the drain current is found to be increase as the channel length decreases. The EMC/MD simulation powered by GPU is a useful method to investigate the dynamic fluctuation as well as the statistical device-to-device variability of nano-scale FETs.
  • Keywords
    MOSFET; Monte Carlo methods; elemental semiconductors; graphics processing units; molecular dynamics method; nanowires; semiconductor device models; silicon; Si; ensemble Monte Carlo simulation; full-scale whole device EMC-MD simulation; gate electrode; gate-all-around nanowire silicon MOSFET; graphic processing unit; molecular dynamics simulation; random dopant distribution; silicon nanowire transistor; source-drain regions; Computational modeling; Electromagnetic compatibility; Fluctuations; Graphics processing units; Logic gates; Resource description framework; Silicon; Graphic Processing Unit (GPU); Si nanowire Transistor; ensemble Monte Carlo/molecular dynamics (EMC/MD); random dopant fluctuation (RDF); random telegraph noise (RTN);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931637
  • Filename
    6931637