DocumentCode
128958
Title
Full-scale whole device EMC/MD simulation of Si nanowire transistor including source and drain regions by utilizing graphic processing units
Author
Suzuki, A. ; Watanabe, Toshio ; Kamakura, Yoshinari ; Kamioka, Takefumi
Author_Institution
Fac. of Sci. & Eng., Waseda Univ., Tokyo, Japan
fYear
2014
fDate
9-11 Sept. 2014
Firstpage
357
Lastpage
360
Abstract
We have realized the full-scale whole device EMC/MD simulation including source and drain regions by utilizing graphic processing unit. The transfer characteristic of a gate-all-around nanowire Si MOSFET is simulated by reproducing the field effect of the surrounding gate electrode with spreading charged particles on the gate insulator layer. We have found an appreciable impact of the random dopant distribution (RDF) in source and drain regions on the drain current variability. Furthermore, the dynamic fluctuation of the drain current is found to be increase as the channel length decreases. The EMC/MD simulation powered by GPU is a useful method to investigate the dynamic fluctuation as well as the statistical device-to-device variability of nano-scale FETs.
Keywords
MOSFET; Monte Carlo methods; elemental semiconductors; graphics processing units; molecular dynamics method; nanowires; semiconductor device models; silicon; Si; ensemble Monte Carlo simulation; full-scale whole device EMC-MD simulation; gate electrode; gate-all-around nanowire silicon MOSFET; graphic processing unit; molecular dynamics simulation; random dopant distribution; silicon nanowire transistor; source-drain regions; Computational modeling; Electromagnetic compatibility; Fluctuations; Graphics processing units; Logic gates; Resource description framework; Silicon; Graphic Processing Unit (GPU); Si nanowire Transistor; ensemble Monte Carlo/molecular dynamics (EMC/MD); random dopant fluctuation (RDF); random telegraph noise (RTN);
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location
Yokohama
ISSN
1946-1569
Print_ISBN
978-1-4799-5287-8
Type
conf
DOI
10.1109/SISPAD.2014.6931637
Filename
6931637
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